Metaharmos UCIe IP provides a scalable, high-performance interconnect solution that enables seamless communication between chiplets in advanced multi-die systems. Built around the Universal Chiplet Interconnect Express (UCIe) standard, our IP facilitates low-latency, high-bandwidth, and energy-efficient die-to-die communication, accelerating the adoption of heterogeneous integration and advanced packaging technologies.
UCIe defines an open industry-standard interface that connects chiplets—whether logic, memory, or I/O—across the same package. By leveraging Metaharmos’ expertise in high-speed PHY, protocol layer design, and mixed-signal integration, our UCIe IP offers a complete end-to-end solution, including the PHY, Link, and Adapter layers compliant with the latest UCIe specifications.